Thermal Camera Core

  • High sensitivity sensor with 384 x 288 resolution
  • NETD is less than 35 mk (@25° C, F#=1.0)
  • Leading thermal image processing technology: Adaptive AGC, DDE, 3D DNR
  • Highly-reliable shutter, up to 300,000 exposures
  • Support CVBS and BT.656
  • Support auto-focus and zoom

Especificación
  • Módulo térmico
  • Sensor de imagenVanadium Oxide Uncooled Focal Plane Arrays
  • NETD< 35mk @ F1.0, 25 °C (86 °F)
  • Respuesta de Waveband8 μm to 14 μm
  • Max. Resolución384 × 288
  • Tamaño de píxel17 μm
  • Frame25 fps (BT656); 50 fps (YUV+RAW)
  • PaletasWhite Hot, Black Hot, Fusion1, Rainbow, Fusion2, Ironbow1, Ironbow2, Sepia, Color1, Color2, Ice Fire, Rain, Green Hot, Red Hot, Dark Blue
  • General
  • alimentación12 VDC
  • Consumo de energía≤ 1.26 mW (TYP) with zoom and focus off
  • Salida de Vídeo8 bit BT.656 (720 × 576)/(YUV+14 bit RAW)
  • First image< 5s
  • Tipo de comunicaciónRS-232 Serial Port
  • Shutter Life300,000 Times
  • Montura del lenteM34*0.75
  • Impact Strength750g/1ms
  • Temperatura de trabajo-40 °C to +70 °C (-40 °F to 158 °F)
  • Temperatura de almacenamiento-45 °C to +85 °C (-49 °F to 185°F)
  • Dimensiones40 mm × 41 mm × 49 mm (1.57 ″× 1.61 ″× 1.93 ″)
  • < 82 g (0.18 lb) (Without lens)
Especificación
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