Thermal Camera Core

  • High sensitivity sensor with 384 x 288 resolution
  • NETD is less than 35 mk (@30° C, F#=1.0)
  • Leading thermal image processing technology: Adaptive AGC, DDE, 3D DNR
  • Supports CVBS and BT.656

Specification
  • Thermal Module
  • Image SensorVanadium Oxide Uncooled Focal Plane Arrays
  • NETD< 35 mk (@30°C,F#=1.0)
  • Response Waveband8 μm to 14 μm
  • Max. Resolution384 × 288
  • Pixel Pitch17 μm
  • Frame25 fps
  • PalettesWhite Hot, Ice Fire, Rainbow, Black Hot, Red Hot, Green Hot, Fusion 1, Fusion 2, Color 1, Color 2, Sepia, Dark Blue, Iron 1, Iron 2, Rain
  • General
  • Power3.6 VDC (2.5 V to 5.5 V)
  • Power Consumption≤ 0.8 w (TYP)
  • Video Output8 bit BT.656 (720x576); Customized LVDS
  • First image< 5s
  • Communication TypeRS-232 Serial Port
  • Lens MountM25 × 0.5
  • Impact Strength750g/1ms
  • Working Temperature-40 °C to +65 °C (-40 °F to 149 °F)
  • Storage Temperature-45 °C to +85 °C (-49 °F to 185°F)
  • Dimensions28 mm × 28 mm × 34.8 mm (1.1 ″ × 1.1 ″ × 1.4 ″)
  • < 34 g (0.07 lb.) (Without lens)
Specification
Download Center

This website uses necessary cookies to enable the website to function well. We would like to use additional cookies to provide you the best experience on our website. For more information, please see our cookie policy.

Contact Us